Flexible interconnect structure for a sensor assembly

ABSTRACT

This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.14/989,332, filed 6 Jan. 2016, entitled “Flexible Interconnect Structurefor a Sensor Assembly,” and published as U.S. Patent ApplicationPublication No. US20160116358 on 28 Apr. 2016. U.S. patent applicationSer. No. 14/989,332 is a Continuation of U.S. patent application Ser.No. 13/834,764, filed 15 Mar. 2013, entitled “Flexible InterconnectStructure for a Sensor Assembly,” published as U.S. Patent ApplicationPublication No. US20140268593 on 18 Sep. 2014, and issued as U.S. Pat.No. 9,265,142 on 16 Feb. 2016, the contents of which are herebyincorporated by reference in their entirety.

TECHNICAL FIELD

This disclosure generally relates to an interconnect, and moreparticularly to a flexible interconnect structure for a sensor assembly.

BACKGROUND

A sensor assembly may include two pressure sensors with each pressuresensor forming, for instance, one-half of a Wheatstone bridge. In thisconfiguration, the two pressure sensors may be used to measuredifferential pressures. Alternatively, the two pressure sensors may beused to measure independent pressures or to redundantly measure the samepressure. Further, each of the two pressure sensors may be used inseparate housings. Each of the two pressure sensors may have a header,which may be used to operatively interconnect the sensor to otherdevices by, for instance, soldering wires to the pins of the header.However, such interconnections may negatively impact the cost, quality,performance, or size of the corresponding device due to, for instance,the labor-intensive assembly of hand-wiring wires to headers andassociated failure rates under high vibration, Accordingly, there is aneed for improved methods, devices, and systems for interconnecting asensor assembly.

SUMMARY OF THE DISCLOSURE

The subject technology relates to methods, devices, and systems foraflexible interconnect structure for a sensor assembly. In oneembodiment, a flexible interconnect structure may be configured toinclude a first flexible section having a frontend and a backend. Theflexible interconnect structure may be configured to include a firstrigid section having a first connection point and a second connectionpoint. The frontend of the first flexible section may be coupled to thefirst rigid section. Further, the first rigid section may be configuredto couple to a first sensor structure via the first and secondconnection points. The flexible interconnect structure may be configuredto include a second flexible section having a frontend and a backend.The second rigid section may have a third connection point and a fourthconnection point. The second rigid section may be coupled to the backendof the first flexible section and the frontend of the second flexiblesection. The second rigid section may be configured to couple to asecond sensor structure via the third and fourth connection points. Theflexible interconnect structure may be configured to include a thirdrigid section having a fifth connection point, a sixth connection pointand a seventh connection point. The third rigid section may be coupledto the backend of the second flexible section. The third rigid sectionmay be configured to couple to a component via the fifth, sixth andseventh connection points. Also, the component may be configured toreceive measurements from the first sensor structure and the secondsensor structure. The first connection point may be coupled to the thirdconnection point. Further, the second connection point may be coupled tothe sixth connection point. Also, the third connection point may becoupled to the fifth connection point. Finally, the fourth connectionpoint may be coupled to the seventh connection point.

BRIEF DESCRIPTION OF THE FIGURES

The present disclosure is illustrated by way of examples, embodimentsand the like and is not limited by the accompanying figures, in whichlike reference numbers indicate similar elements. Elements in thefigures are illustrated for simplicity and clarity and have notnecessarily been drawn to scale. The figures along with the detaileddescription are incorporated and form part of the specification andserve to further illustrate examples, embodiments and the like, andexplain various principles and advantages, in accordance with thepresent disclosure, where:

FIG. 1 illustrates a top view of one embodiment of a flexibleinterconnect structure for a differential sensor in accordance withvarious aspects set forth herein.

FIG. 2 illustrates a top view of one embodiment of a flexibleinterconnect structure for redundant sensors in accordance with variousaspects set forth herein.

FIG. 3 illustrates one embodiment of a system having a flexibleinterconnect structure for a sensor assembly in accordance with variousaspects set forth herein.

FIG. 4 illustrates a partial longitudinal cross-sectional view ofanother embodiment. of a sensor assembly having a flexible interconnectstructure in accordance with various aspects set forth herein.

FIG. 5 illustrates a partial longitudinal cross-sectional view of oneembodiment of a sensor assembly having a flexible interconnect structurein accordance with various aspects set forth herein.

DETAILED DESCRIPTION

The following detailed description is merely illustrative in nature andis not intended to limit the present disclosure, or the application anduses of the present disclosure. Furthermore, there is no intention to bebound by any expressed or implied theory presented in the precedingfield of use, background, or summary of the disclosure or the followingdetailed description. The present disclosure provides various examples,embodiments and the like, which may be described herein in terms offunctional or logical block elements. Various techniques describedherein may be used for a flexible interconnect structure for a sensorassembly. The various aspects described herein are presented as methods,devices (or apparatus), and systems that may include a number ofcomponents, elements, members, modules, nodes, peripherals, or the like.Further, these methods, devices, and systems may include or not includeadditional components, elements, members, modules, nodes, peripherals,or the like.

Throughout the specification and the claims, the following terms take atleast the meanings explicitly associated herein, unless the contextclearly dictates otherwise. The terms “connect,” “connecting,” and“connected” mean that one function, feature, structure, orcharacteristic is directly joined to or in communication with anotherfunction, feature, structure, or characteristic. The terms “couple,”“coupling,” and “coupled” mean that one function, feature, structure, orcharacteristic is directly or indirectly joined to or in communicationwith another function, feature, structure, or characteristic. Relationalterms such as “first” and “second,” and the like may be used solely todistinguish one entity or action from another entity or action withoutnecessarily requiring or implying any actual such relationship or orderbetween such entities or actions. The term “or” is intended to mean aninclusive “or.” Further, the terms “a,” “an,” and “the” are intended tomean one or more unless specified otherwise or clear from the context tobe directed to a singular form. The term “include” and its various formsare intended to mean including but not limited to.

In the following description, numerous specific details are set forth.However, it is to be understood that embodiments of the disclosedtechnology may be practiced without these specific details, Referencesto “one embodiment,” “an embodiment,” “example embodiment,” “variousembodiments,” and other like terms indicate that the embodiments of thedisclosed technology so described may include a particular function,feature, structure, or characteristic, but not every embodimentnecessarily includes the particular function, feature, structure, orcharacteristic. Further, repeated use of the phrase “in one embodiment”does not necessarily refer to the same embodiment, although it may.

This disclosure provides example methods, devices, and systems for aflexible interconnect structure for a sensor assembly. In oneconfiguration, as shown in FIG. 1, a flexible interconnect structure maycouple a first portion of a differential sensor structure to a secondportion of the differential sensor structure. Further, the flexibleinterconnect structure may couple the differential sensor structure toan external component such as a circuit board, used to receivemeasurement information from the differential sensor. FIG. 1 illustratesa top view of one embodiment of a flexible interconnect structure 100for a differential sensor in accordance with various aspects set forthherein. In one example, the flexible interconnect structure 100 may beused for a differential sensor. The flexible interconnect structure 100may be configured to include first, second and third rigid sections 103,104 and 105 and a first and second flexible sections 109 and 110,respectively. Each of the first and second flexible sections 109 and 110may have a frontend and a backend. The frontend of the first flexiblesection 109 may be coupled to the first rigid section 103 and thebackend of the first flexible section 109 may be coupled to the secondrigid section 104. Similarly, the frontend of the second flexiblesection 110 may be coupled to the second rigid section 104 and thebackend of the second flexible section 110 may be coupled to the thirdrigid section 105.

In FIG. 1, the first rigid section 103 may be configured to includefirst and second connection points 115 and 116, respectively. The firstand second connection points 115 and 116 may be used to couple the firstrigid section 103 to a component such as a sensor structure or a circuitboard. The second rigid section 104 may be configured to include thirdand fourth connection points 117 and 118, respectively. The third andfourth connection points 117 and 118 may be used to couple the secondrigid section 104 to a component such as a sensor structure or a circuitboard. The third rigid section 105 may be configured to include fifth,sixth and seventh connection points 119, 120 and 121, respectively. Thefifth, sixth and seventh connection points 119, 120 and 121 may be usedto couple the third rigid section 105 to a component such as a sensorstructure or a circuit board. Each of the connection points 115 to 121may be plated such as with copper or may be a through hole. A contact orlead of a component may be soldered onto or into one or more of theconnection points 115 to 121. Further, one or more of the connectionpoints may be attached to a contact or lead of a component via aspring-loaded or crimp contact soldered onto or into one or more of theconnection points.

In this embodiment, each of the flexible sections 109 and 110 mayinclude one or more traces 113 and 114, respectively. Each of the traces113 and 114 may be used to couple two or more connection points 115 to121. For example, a trace of the first flexible section 109 may couplethe first connection point 115 of the first rigid section 103 to thethird connection point 117 of the second rigid section 104. In anotherexample, a trace of the second flexible section 110 may couple the thirdconnection point 117 of the second rigid section 104 to the fifthconnection point 119 of the third rigid section 105. In another example,a trace of the first flexible section 109 and a trace of the secondflexible section 110 may couple the second connection point 116 of thefirst rigid section 103 to the sixth connection point 120 of the thirdrigid section 105. In another example, a trace of the second flexiblesection 110 may couple the fourth connection point 118 of the secondrigid section 104 to the seventh connection point 121 of the third rigidsection 105, Each of the traces 113 and 114 may be a metal such ascopper.

In FIG. 1, in operation, for example, one or more of the connectionpoints 115 and 116 of the first rigid section 103 may be coupled to aconnector such as a header pin, a contact or a lead of a first portionof a differential sensor structure. Further, one or more of theconnection points 117 and 118 of the second rigid section 104 may becoupled to a connector of a second portion of the differential sensorstructure. Also, one or more of the connection points 119, 120 and 121of the third rigid section 105 may be coupled to a connector of acomponent such as a circuit board, used to receive measurements from thedifferential sensor structure.

In another configuration, as shown in FIG. 2, a flexible interconnectstructure may be configured to support two redundant sensors rather thana differential sensor. For example, the flexible interconnect structuremay couple a first sensor structure and a second sensor structure to acomponent such as used to receive measurement information from the firstand second sensor structures. FIG. 2 illustrates a top view of oneembodiment of a flexible interconnect structure 200 for redundantsensors in accordance with various aspects set forth herein. Theflexible interconnect structure 200 may be configured to include first,second and third rigid sections 203, 204 and 205 and a first and secondflexible sections 209 and 210, respectively. Each of the first andsecond flexible sections 209 and 210 may have a frontend and a backend.The frontend of the first flexible section 209 may be coupled to thefirst rigid section 203 and the backend of the first flexible section209 may be coupled to the second rigid section 204. Similarly, thefrontend of the second flexible section 210 may be coupled to the secondrigid section 204 and the backend of the second flexible section 210 maybe coupled to the third rigid section 205.

In FIG. 2, the first rigid section 203 may be configured to includefirst and second connection points 215 and 216, respectively. The firstand second connection points 215 and 216 may be used to couple the firstrigid section 203 to a component such as a sensor structure or a circuitboard. The second rigid section 204 may be configured to include thirdand fourth connection points 217 and 218, respectively. The third andfourth connection points 217 and 218 may be used to couple the secondrigid section 204 to a component such as a sensor structure or a circuitboard. The third rigid section 205 may be configured to include fifth,sixth and seventh connection points 219, 220 and 221, respectively. Thefifth, sixth and seventh connection points 219, 220 and 221 may be usedto couple the third rigid section 205 to a component such as a sensorstructure or a circuit board.

In this embodiment, each of the flexible sections 209 and 210 mayinclude one or more traces 213 and 214, respectively. Each of the traces213 and 214 may be used to couple two or more connection points 215 to221. For example, a trace of the first flexible section 209 may couplethe first connection point 215 of the first rigid section 203 to thethird connection point 217 of the second rigid section 204. In anotherexample, a trace of the second flexible section 210 may couple the thirdconnection point 217 of the second rigid section 204 to the fifthconnection point 219 of the third rigid section 205. In another example,a trace of the first flexible section 209 and a trace of the secondflexible section 210 may couple the second connection point 216 of thefirst rigid section 203 to the sixth connection point 220 of the thirdrigid section 205. In another example, a trace of the second flexiblesection 210 may couple the fourth connection point 218 of the secondrigid section 204 to the seventh connection point 221 of the third rigidsection 205. Each of the traces 213 and 214 may be a metal such ascopper.

In FIG. 2, in operation, for example, the first rigid section 203 may becoupled to a connector such as a header pin, a contact or a lead of afirst sensor structure via the connection points of the first rigidsection 203. Further, the second rigid section 204 may be coupled to aconnector of a second sensor structure via the connection points of thefirst rigid section 204. Also, the third rigid section 205 may becoupled to a connector of a component such as a circuit board, which maybe used to receive measurements from or control the first and secondsensor structures. Such configuration may allow for the use of redundantsensors or differential sensors.

FIG. 3 illustrates one embodiment of a system 300 having a flexibleinterconnect structure 302 fora sensor assembly 301 in accordance withvarious aspects set forth herein. The system 300 may be configured toinclude the sensor assembly 301, the flexible interconnect structure302, and a component 341. The sensor assembly 301 and a portion of theflexible interconnect structure 302 associated with the sensor assembly301 are illustrated in FIG. 3 as a partial longitudinal cross-sectionalview. The component 341 and a portion of the flexible interconnectstructure 302 associated with the component 341 are illustrated in FIG.3 as a side view.

In FIG. 3, the sensor assembly 301 may be configured to include a firstsensor structure 319, a second sensor structure 320, a front port 332and a reference port 333. In one example, each of the first and secondsensor structures 319 and 320 may be configured to measure pressures ofa fluid. In another example, the first and second sensor structure 319and 320 may be configured to form a differential pressure sensor orredundant sensors. In another example, the first sensor structure 319may form a first half of a Wheatstone bridge and the second sensorstructure 320 may form a second half of the Wheatstone bridge. The firstsensor structure 319 may be configured to include a first sensor element321, a first header 323 and first and second header pins 325 and 326.Similarly, the second sensor structure 320 may be configured to includea second sensor element 322, a second header 324 and third and fourthheader pins 327 and 328. Each of the first and second sensor elements321 and 322 may be configured collectively or individually as a pressuresensor. Each of the first and second headers 323 and 324 may include aheader shell that defines a sensor cavity. In one example, the headershell may be metal. Further, the sensor cavities of each of the firstand second headers 323 and 324 may house the first and second sensorelements 321 and, respectively. The first and second header pins 325 and326 may be electrically coupled to the first sensor element 321.Further, the third and fourth header pins 327 and 328 may beelectrically coupled to the second sensor element 322. It is importantto note that a person of ordinary skill in the art will recognize thevarious structures, configurations and uses of sensors.

In FIG. 3, the flexible interconnect structure 302 may be configured toinclude first, second and third rigid sections 303, 304 and 305 and afirst and second flexible sections 309 and 130, respectively. Each ofthe first and second flexible sections 309 and 310 may have a frontendand a backend. The frontend of the first flexible section 309 may becoupled to the first rigid section 303 and the backend of the firstflexible section 309 may be coupled to the second rigid section 304.Similarly, the frontend of the second flexible section 310 may becoupled to the second rigid section 304 and the backend of the secondflexible section 310 may be coupled to the third rigid section 305. Theflexible interconnect structure 302 may be bent around the inside of thesensor assembly 301 such that the first rigid section 303 is directlybehind the first header 323. Similarly, the flexible interconnectstructure 303 may be bent around the inside of the sensor assembly 301such that the second rigid section 304 is directly behind the secondheader 324.

In this embodiment, the first rigid section 303 may be configured toinclude first and second connection points 315 and 316, respectively.The first and second connection points 315 and 316 may be used to couplethe first rigid section 303 to the first sensor structure 319. Forexample, the first rigid section 303 may be pressed onto the back of thefirst header 323 such that the first and second header pins 325 and 326pass through the first and second connection points 315 and 316 tocouple to the first sensor structure 319. The second rigid section 304may be configured to include third and fourth connection points 317 and318, respectively. The third and fourth connection points 317 and 318may be used to couple the second rigid section 304 to the second sensorstructure 320. For example, the second rigid section 304 may be pressedonto the back of the second header 324 such that the third and fourthheader pins 327 and 328 pass through the third and fourth connectionpoints 317 and 318, respectively, to couple to the second sensorstructure 320. The third and fourth connection points 317 and 318 may beused to couple the second rigid section 304 to a component such as acircuit board. The third rigid section 305 may be configured to includeone or more connection points. The one or more connection points of thethird rigid section 305 may be used to couple the third rigid section305 to a component such as a sensor structure or a circuit board.

In FIG. 3, each of the flexible sections 309 and 310 may include one ormore traces. The one or more traces may be used to couple two or moreconnection points. For example, a trace of the first flexible section309 may couple the first connection point 315 of the first rigid section303 to the third connection point 317 of the second rigid section 304.In another example, a trace of the second flexible section 310 maycouple the third connection point 317 of the second rigid section 304 toa connection point of the third rigid section 305. In another example, atrace of the first flexible section 309 and a trace of the secondflexible section 130 may couple the second connection point 316 of thefirst rigid section 303 to a connection point of the third rigid section305. In another example, a trace of the second flexible section 130 maycouple the fourth connection point 318 of the second rigid section 304to a connection point of the third rigid section 305. Each of the tracesmay be a metal such as copper.

In this embodiment, one or more of the connection points 315 and 316 ofthe first rigid section 303 may be coupled to the first sensor structure319 via the header pins 325 and 326 to form, for instance, a firstportion of a differential sensor structure, a first half of a Wheatstonebridge, a first redundant sensor, or other similar structure. In oneexample, the first rigid section 303 may be pressed onto the back of thefirst header 323 such that the first and second header pins 325 and 326pass through the first and second connection points 315 and 316,respectively, using spring-loaded connection points to couple to thefirst sensor structure 319. In another example, the first and secondconnection points 315 and 316 may be crimped or soldered to the firstrigid section 303 to allow for a more rugged contact. In either case,such connection schemes are quicker, easier, or more reliable thansoldering individual wires to each header pin. The first flexiblesection 309 may pass through or around any small sections or openings ofthe sensor assembly 301 to allow the second rigid section 304 to be, forinstance, soldered or pressed onto the second sensor structure 320. Thethird and fourth connection points 317 and 318 of the second rigidsection 304 may be coupled to the third and fourth header pins 327 and328 of the second sensor structure 320, respectively, to form, forinstance, a second portion of a differential sensor structure, a secondhalf of a Wheatstone bridge, a second redundant sensor, or other similarstructure. The second flexible section 310 may pass through or aroundany small sections or openings of the sensor assembly 301 such as thesecond opening 335 and may be, for instance, soldered or pressed ontothe component 341, which may receive pressure measurements from thesensor assembly 301, perform temperature compensation of such pressuremeasurements, or other similar functions for measuring pressure.

A person of ordinary skill in the art will recognize that anotheradvantage of the flexible interconnect structure 302 applied to thesensor assembly 301 is that it allows for coupling, for instance, twohalves of a Wheatstone bridge using the flexible interconnect structure302 rather than using the component 341 to couple all of theconnections. Thus, such configuration may allow for fewer connectionsfrom the sensor assembly 301 to the component 341. For example, atypical sensor configuration for the sensor assembly 301 may require sixconnections between the first and second headers 323 and 324 of thesensor assembly 301, respectively, and a header of the component 341. Byusing the flexible interconnect structure 302, only four connections maybe required between the first and second headers 323 and 324 of thesensor assembly 301, respectively, and a header of the component 341.

The flexible interconnect structure may be used for different sensorconfigurations and, in some instances, without changing theconfiguration of the flexible interconnect structure. For example, FIG.4 illustrates a partial longitudinal cross-sectional view of anotherembodiment of a sensor assembly 400 having a flexible interconnectstructure 402 in accordance with various aspects set forth herein. InFIG. 4, the sensor assembly 400 may be configured to include first andsecond sensor structures 419 and 420 contained in a cavity of a housing432 and interfacing to an external component via a connector 451. In oneexample, each of the first and second sensor structures 419 and 420 maybe configured to measure pressures of a fluid. In another example, thefirst and second sensor structure 419 and 420 may be configured to forma differential pressure sensor or redundant sensors. In another example,the sensor element of the first sensor structure 419 may form a firsthalf of a Wheatstone bridge and the sensor element of the second sensorstructure 420 may form a second half of the Wheatstone bridge. Each ofthe first and second sensor structures 419 and 420 may be configured toinclude a sensor element, a header and one or more header pins. Each ofthe headers of the first and second sensor structures 419 and 420 mayinclude a header shell that defines a sensor cavity. In one example, theheader shell may be metal. Further, each sensor cavity of the first andsecond sensor structures 419 and 420 may house one or more sensorelements. The header pins of each of the first and second sensorstructures 419 and 420 may be electrically coupled to its sensorelement.

In FIG. 4, the flexible interconnect structure 402 may be configured toinclude first, second and third rigid sections 403, 404 and 405 andfirst and second flexible sections 409 and 410, respectively. Each ofthe first and second flexible sections 409 and 410 may have a frontendand a backend. The frontend of the first flexible section 409 may becoupled to the first rigid section 403 and the backend of the firstflexible section 409 may be coupled to the second rigid section 404.Similarly, the frontend of the second flexible section 410 may becoupled to the second rigid section 404 and the backend of the secondflexible section 410 may be coupled to the third rigid section 405. Theflexible interconnect structure 402 may bend within the cavity 438 ofthe sensor assembly 400 such that the first rigid section 403 isdirectly behind the header of the first sensor structure 419. Similarly,the flexible interconnect structure 403 may bend within the cavity 438of the sensor assembly 401 such that the second rigid section 404 isdirectly behind the header of the second sensor structure 420.

In this embodiment, the first rigid section 403 may be configured toinclude one or more connection points. The one or more connection pointsof the first rigid section 403 may be used to couple the first rigidsection 403 to the first sensor structure 419. The first rigid section403 may be pressed onto the back of a header of the first sensorstructure 419 such that the one or more header pins of the first sensorstructure 419 pass through the one or more connection points of thefirst rigid section 403 to couple to the first sensor structure 419. Thesecond rigid section 404 may be configured to include one or moreconnection points. The one or more connection points of the second rigidsection 404 may be used to couple the second rigid section 404 to thesecond sensor structure 420. The second rigid section 404 may be pressedonto the back of a header of the second sensor structure 420 such thatthe one or more header pins of the second sensor structure 420 passthrough the connection points of the second rigid section 404 to coupleto the second sensor structure 420. The third rigid section 405 may beconfigured to include one or more connection points. The one or moreconnection points of the third rigid section 405 may be used to couplethe third rigid section 405 to an external component via the connector451, which may be used to couple the sensor assembly 400 to an externalcomponent such as a circuit board used to control or acquiremeasurements from the sensor assembly 400.

In FIG. 4, each of the flexible sections 409 and 410 may include one ormore traces. The one or more traces may be used to couple connectionpoints between rigid sections 403, 404 and 405. For example, a trace ofthe first flexible section 409 may couple a connection point of thefirst rigid section 403 to a connection point of the second rigidsection 404. In another example, a trace of the second flexible section410 may couple a connection point of the second rigid section 404 to aconnection point of the third rigid section 405. In another example, atrace of the first flexible section 409 and a trace of the secondflexible section 130 may couple a connection point of the first rigidsection 403 to a connection point of the third rigid section 405. Inanother example, a trace of the second flexible section 410 may couple aconnection point of the second rigid section 404 to a connection pointof the third rigid section 405.

In another example of a sensor assembly configuration, FIG. 5illustrates a partial longitudinal cross-sectional view of oneembodiment of a sensor assembly 500 having a flexible interconnectstructure 502 in accordance with various aspects set forth herein. InFIG. 5, the sensor assembly 500 may be configured to include a firstsensor structure 519, a second sensor structure 520, a housing 532, aconnector 551 and the flexible interconnect structure 502. The firstsensor structure 519 may be configured to include a first sensor element521, a first header 523 and a first and second header pins 525 and 526.Similarly, the second sensor structure 520 may be configured to includea second sensor element 522, a second header 524 and a second and thirdheader pins 527 and 528. Each of the first and second sensor elements521 and 522 may be configured collectively or individually as a pressuresensor. In another example, the first sensor element 521 may form afirst half of a Wheatstone bridge and the second sensor element 522 mayform a second half of the Wheatstone bridge. Each of the first andsecond headers 523 and 524 may include a header shell that defines asensor cavity. Further, the sensor cavities of each of the first andsecond headers 523 and 24 may house the first and second sensor elements521 and 522, respectively. The first and second header pins 525 and 526may be electrically coupled to the first sensor element 521. Further,the third and fourth header pins 527 and 528 may be electrically coupledto the second sensor element 522.

In FIG. 5, the flexible interconnect structure 502 may be configured toinclude first, second and third rigid sections 503, 504 and 505 and afirst and second flexible sections 509 and 510, respectively. Each ofthe first and second flexible sections 509 and 510 may have a frontendand a backend. The frontend of the first flexible section 509 may becoupled to the first rigid section 503 and the backend of the firstflexible section 509 may be coupled to the second rigid section 504.Similarly, the frontend of the second flexible section 510 may becoupled to the second rigid section 504 and the backend of the secondflexible section 510 may be coupled to the third rigid section 505. Theflexible interconnect structure 502 may bend around the inside of thesensor assembly 501 such that the first rigid section 503 is directlybehind the first header 523 of the first sensor structure 519.Similarly, the flexible interconnect structure 502 may bend around theinside of the sensor assembly 501 such that the second rigid section 504is directly behind the second header 524 of the second sensor structure520.

In this embodiment, the first rigid section 503 may be configured toinclude one or more connection points. The one or more connection pointsof the first rigid section 503 may be used to couple the first rigidsection 503 to the first sensor structure 519. The first rigid section503 may be pressed onto the back of the first header 523 such that thefirst and second header pins 525 and 526 pass through the two connectionpoints of the first rigid section 503 to couple to the first sensorstructure 519. The second rigid section 504 may be configured to includeone or more connection points. The second rigid section 504 may bepressed onto the back of the second header 524 such that the third andfourth header pins 527 and 528 pass through the two connection points ofthe second rigid section 504 to couple to the second sensor structure520. The third and fourth connection points 517 and 518 may be used tocouple the second rigid section 504 to the second sensor structure 520.The third rigid section 505 may be configured to include one or moreconnection points. The one or more connection points of the third rigidsection 505 may be used to couple the third rigid section 505 to theconnector 551, which may be used to couple the sensor assembly 500 to anexternal component such as a circuit board used to control or acquiremeasurements from the sensor assembly 500.

In FIG. 5, each of the flexible sections 509 and 510 may include one ormore traces. The one or more traces may be used to couple two or moreconnection points. For example, a trace of the first flexible section509 may couple a connection point of the first rigid section 503 to aconnection point of the second rigid section 504. In another example, atrace of the second flexible section 510 may couple a connection pointof the second rigid section 504 to a connection point of the third rigidsection 505. In another example, a trace of the first flexible section509 and a trace of the second flexible section 130 may couple aconnection point of the first rigid section 503 to a connection point ofthe third rigid section 505. In another example, a trace of the secondflexible section 130 may couple a connection point of the second rigidsection 504 to a connection point of the third rigid section 505. Eachof the traces may be a metal such as copper.

It is important to recognize that it is impractical to describe everyconceivable combination of components or methodologies for purposes ofdescribing the claimed subject matter. However, a person having ordinaryskill in the art will recognize that many further combinations andpermutations of the subject technology are possible. Accordingly, theclaimed subject matter is intended to cover all such alterations,modifications and variations that are within the spirit and scope of theclaimed subject matter.

Although the present disclosure describes specific examples,embodiments, and the like, various modifications and changes may be madewithout departing from the scope of the present disclosure as set forthin the claims below. For example, although the example methods, devicesand systems, described herein are in conjunction with a configurationfor the aforementioned flexible interconnect structure for a sensorassembly, the skilled artisan will readily recognize that the examplemethods, devices or systems may be used in other methods, devices orsystems and may be configured to correspond to such other examplemethods, devices or systems as needed. Further, while at least oneexample, embodiment, or the like has been presented in the foregoingdetailed description, many variations exist. Accordingly, thespecification and figures are to be regarded in an illustrative ratherthan a restrictive sense, and all such modifications are intended to beincluded within the scope of the present disclosure. Any benefits,advantages, or solutions to problems that are described herein withregard to specific embodiments are not intended to be construed as acritical, required, or essential feature or element of any or all of theclaims. Any benefits, advantages, or solutions to problems that aredescribed herein with regard to specific examples, embodiments, or thelike are not intended to he construed as a critical, required, oressential feature or element of any or all of the claims.

We claim:
 1. A method, comprising: configuring a first sensor structureconfigured to measure a first pressure; configuring a second sensorstructure configured to measure a second pressure; configuring a mainconnector to interface with an external component; assembling a flexibleinterconnect structure, the assembling comprising: electrically couplinga first rigid section with the first sensor structure; electricallycoupling a first flexible section with the first rigid section, thefirst flexible section having a frontend; electrically coupling a secondrigid section with the second sensor structure, the second rigid sectionhaving a frontend in electrical communication with a backend of thefirst flexible section; electrically coupling a frontend of a secondflexible section with a backend of the second rigid section;electrically coupling a third rigid section with the main connector, thethird rigid section having a frontend in electrical communication with abackend of the second flexible section, wherein the third rigid sectionis configured to receive signals from the first sensor structure and thesecond sensor structure; installing, in a housing, the flexibleinterconnect structure; and connecting the flexible interconnectstructure to the first sensor structure, the second sensor structure,and the main connector; wherein each of the first rigid section, thesecond rigid section, and the third rigid section is an independentlyrigid printed circuit board (PCB) integrated with the flexibleinterconnect structure and wherein each of the first sensor structureand the second sensor structure comprises: a header; a sensor element;and one or more header pins coupled to the header and electricallycoupled to the sensor element.
 2. The method of claim 1, furthercomprising configuring the first flexible section and the secondflexible section to bend within a cavity formed by the housing.
 3. Themethod of claim 1, further comprising mounting the first rigid sectionand the second rigid section to the respective header for electricalcommunication with the respective sensor element.
 4. The method of claim1, further comprising measuring an applied pressure with one or more ofthe first sensor structure and the second sensor structure.
 5. Themethod of claim 1, further comprising measuring a difference in pressurebetween the first sensor structure and the second sensor structure. 6.The method of claim 1, wherein one or more of the first sensor structureand the second sensor structure are configured as redundant pressuresensors.
 7. The method of claim 1, wherein the first sensor structureforms a first half of a Wheatstone bridge and the second sensorstructure forms a second half of the Wheatstone bridge.
 8. The method ofclaim 1, wherein the first sensor structure includes a first conductorand a second conductor, wherein the first conductor is coupled to afirst connection point and the second conductor is coupled to a secondconnection point; wherein the second sensor structure includes a thirdconductor and a fourth conductor, wherein the third conductor is coupledto a third connection point and the fourth conductor is coupled to afourth connection point; and wherein the main connector includes a fifthconductor, a sixth conductor and a seventh conductor, wherein the fifthconductor is coupled to a fifth connection point, the sixth conductor iscoupled to a sixth connection point, and the seventh conductor iscoupled to a seventh connection point.
 9. The method of claim 1, whereineach of the first, second, third, fourth, fifth, sixth and seventhconnection points comprise one or more of through hole and platedconnection points.